| Graphite | Approximately 1,600–2,000°C in a controlled inert or reducing atmosphere | Excellent; heats and cools rapidly with relatively low risk of cracking | Low in air at elevated temperature; oxidation can begin at approximately 500–600°C | Excellent when oxidation is controlled; commonly used for copper and copper alloys | High thermal conductivity, fast heating, good resistance to thermal shock, and relatively low metal adhesion | Oxidizes in air, can be affected by some reactive slags, and requires careful handling because it is brittle | Frequent melting of copper, brass, bronze, and other non-ferrous alloys in electric or fuel-fired furnaces with controlled atmosphere |
| Clay-Graphite | Approximately 1,200–1,600°C, depending on composition and operating conditions | Very good; generally more forgiving than dense ceramic crucibles | Moderate; the graphite portion requires protection from prolonged exposure to air | Very good for routine copper melting and many copper-alloy processes | Good balance of thermal shock resistance, mechanical strength, and cost | Can oxidize, absorb moisture if stored improperly, and may have a shorter life under aggressive flux conditions | General-purpose copper melting, small foundries, workshops, and batch production using fuel-fired or electric furnaces |
| Silicon Carbide | Approximately 1,400–1,600°C in typical crucible service | Excellent to very good, depending on density, bonding system, and crucible design | Good; develops a protective silica layer, although prolonged high-temperature oxidation can still cause wear | Excellent for copper and copper alloys when the crucible is properly conditioned | High thermal conductivity, strong resistance to abrasion, good durability, and fast heat transfer | Thermal performance varies by formulation; may be damaged by severe mechanical impact or incompatible fluxes | Medium- to high-frequency melting, repeated production cycles, and applications requiring good energy efficiency |
| Alumina Ceramic | Approximately 1,600–1,800°C, depending on alumina purity and design | Moderate to low compared with graphite and silicon carbide | Excellent in air | Very good for high-purity copper when contamination control is important | High chemical stability, strong electrical insulation, and low contamination potential | Lower thermal shock resistance, slower heat transfer, and greater sensitivity to rapid temperature changes | Laboratory melting, analytical work, high-purity copper, and controlled-atmosphere processes |
| Zirconia Ceramic | Approximately 2,000–2,400°C, depending on stabilization and operating conditions | Moderate; better fracture toughness than many traditional ceramics but still requires controlled heating and cooling | Excellent in air | Excellent for specialized high-purity or high-temperature copper processing | Very high refractoriness, low chemical reactivity, and strong resistance to many molten materials | High cost, relatively low thermal conductivity, and greater risk of thermal-gradient damage | Specialized laboratory or industrial processes where chemical purity and extreme temperature capability justify the cost |
| Fused Silica | Approximately 1,100–1,200°C for continuous service, depending on product design | Excellent; very low thermal expansion provides strong resistance to thermal shock | Excellent in air | Suitable for limited copper melting cycles, but not generally preferred for long-term production use | Very low thermal expansion, good visual clarity in some designs, and low contamination | Softens at temperatures close to copper melting conditions and has limited mechanical durability for repeated heavy-duty use | Small laboratory melts, sampling, and short-duration experimental work near the copper melting point of 1,084.62°C |