| Precision dimensional measurement | Outer diameter, hole diameter, edge position, thickness, and distance measurement | Object-side telecentric; bi-telecentric when magnification stability is critical | Approximately 0.5×–2.0× | Preferably within ±0.1% of image-space scale for demanding measurement systems | Typically 100–200 mm | Match the lens resolution to the pixel size and tolerance; use controlled coaxial or diffuse lighting to reduce edge uncertainty. |
| Electronic component inspection | Lead spacing, connector dimensions, solder-joint position, and component placement | Object-side telecentric; zoom capability is useful when board formats vary | Approximately 0.3×–1.0× | Common target: ±0.1%–±0.2%, depending on tolerance and field size | Typically 80–150 mm | Check sensor coverage, chief-ray angle compatibility, and illumination clearance around tall components. |
| Semiconductor and wafer inspection | Fine pattern inspection, die dimensions, alignment marks, and surface defects | High-resolution object-side telecentric or bi-telecentric design | Approximately 0.5×–2.0× | Often targeted below ±0.1% for stable dimensional comparison | Typically 50–150 mm | Prioritize low distortion, high modulation transfer performance, low flare, and compatibility with monochromatic or narrow-band lighting. |
| Automotive parts inspection | Gasket profile, machined features, clips, fasteners, and molded-part dimensions | Object-side telecentric zoom lens; choose a larger field of view when parts vary in size | Approximately 0.1×–0.5× | Typically ±0.2% or better for general dimensional inspection | Typically 100–250 mm | Consider depth of field, vibration tolerance, long-distance lighting, and a mechanically fixed zoom position after setup. |
| Plastic molding and extrusion inspection | Flash, deformation, wall thickness, profile, and surface defects | Object-side telecentric with extended depth of field; bi-telecentric for high-accuracy profiles | Approximately 0.1×–0.7× | Usually ±0.2%–±0.5%, depending on part geometry and tolerance | Typically 100–300 mm | Balance aperture and depth of field; use diffuse or dome illumination to minimize highlights on glossy surfaces. |
| Pharmaceutical packaging inspection | Cap position, label alignment, blister geometry, fill level, and seal integrity | Object-side telecentric zoom lens for repeatable scale across package height variations | Approximately 0.1×–0.5× | Typically ±0.2%–±0.5% for dimensional checks | Typically 100–250 mm | Select a sealed or cleanable mechanical design where required; verify working distance and lighting access before installation. |
| Web, film, and sheet inspection | Width, edge position, coating defects, holes, scratches, and pattern registration | Object-side telecentric when dimensional accuracy is important; line-scan optics may be preferable for continuous webs | Approximately 0.05×–0.3× | Typically ±0.2%–±0.5% for dimensional monitoring | Typically 150–400 mm | Check field width, distortion across the full sensor, motion blur, and uniform illumination over the inspection area. |
| General presence and absence inspection | Part presence, orientation, assembly completeness, and gross feature detection | Low- to medium-telecentric object-side lens; standard machine-vision lens may be sufficient if scale variation is acceptable | Approximately 0.05×–0.3× | Often ±0.5% or application-dependent | Typically 100–300 mm | Do not over-specify telecentricity when measurement is not required; prioritize field of view, depth of field, cost, and installation space. |